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Design problems in precision engineering systems → High and ultra-high precision positioning (especially based on compliant devices) – theoretical and experimental analysis and optimization of electromechanical and micro (opto) electromechanical (M(O)EMS) systems.
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Handling, assembly and packaging of microsystems (which today make-up up to 60 … 80% of their costs) – overcoming the limitations of 2D manufacturing technologies, stacking IC, optical or microfluidodynamic systems.
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Integration of mechanical into mechatronics systems for high- and ultra-high precision positioning – analysis of macro and micro mechanical nonlinearities and implementation of actuation, measurement and control systems.
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Energy harvesting (scavenging) mechatronics systems based on the vibration of piezoelectric elements.
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Development of innovative analytical and numerical methodologies and experimental systems aimed at the characterization of mechanical properties scaling phenomena for applications in micro and nano systems.
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Microsystem production technologies: deep X-ray lithography (LIGA technology) at synchrotron radiation facilities (such as Elettra near Trieste, Italy).
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